High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low

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High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low

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High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low

High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃ The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and ...

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thermal insulating materials

heat sensitive materials

0.95 W/mK Thermal changing materials

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