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Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

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Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

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Brand Name : Ziitek

Model Number : TIC™808G series

Certification : RoHs

Place of Origin : China

MOQ : 1000PCS

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bay

Product Name : Phase Changing Materials (PCM)

Color : Gray

Thermal Conductivity : 5.0 W/mK

Density : 2.6g/cc

Temperature range : -25℃~125℃

Thickness : 0.127~0.25mmT

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Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

Applications Include:


> LED Lighting

> Thermal test stands

> DC/DC Converts

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

> Telecommunication

Features:

For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required

Typical Properties of TICTM800G Series
Product Name TICTM805G TICTM808G TICTM810G TICTM812G Test Method
Color Gray Gray Gray Gray Visual
Thickness 0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
0.012"
(0.305mm)
 
Thickness Tolerance ±0.0008''
(±0.019mm)
±0.0008''
(±0.019mm)
±0.0012''
(±0.030mm)
±0.0012''
(±0.030mm)
 
Density 2.6g/cc Helium Pycnometer
Temperature range -25℃~125℃  
Phase Change Softening Temperature 50℃~60℃  
Thermal Conductivity 5.0 W/mK ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa) 0.014℃-in²/W 0.020℃-in²/W 0.038℃-in²/W 0.058℃-in²/W ASTM D5470 (modified)
0.09℃-cm²/W 0.13℃-cm²/W 0.25℃-cm²/W 0.37℃-cm²/W

Standard Thicknesses:


0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
Consult the factory alternate thickness.

Standard Sizes:


10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:


Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.

Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


Product Tags:

thermal insulating materials

      

heat sensitive materials

      

Phase Changing Materials 5.0 W/mK

      
Quality Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow for sale

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