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4.0 W/Mk Mainboard Thermal Gap Pad 0.5mm Thickness

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4.0 W/Mk Mainboard Thermal Gap Pad 0.5mm Thickness

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Brand Name : ZIITEK

Model Number : TIF120N-40-10F thermal pad

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

part number : TIF120N-40-10F

Thickness : 0.5mmT

keyword : thermal gap pad

name : 4.0 W/mK Soft and Compressible for Low Stress Applications Tthermal Pad for Mainboard

Density : 2.1 g/cm3

Dielectric Constant : 4.7 MHz

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4.0 W/mK Soft and Compressible for Low Stress Applications Tthermal Pad for Mainboard

The TIF120N-40-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF100N-40-10F-Specification-sheet.pdf

Features

> Good thermal conductive: 4.0 W/mK

>Thickness: 0.5mmT

>hardness:55±5 shore 00

>Colour: Gray

>Naturally tacky needing no further adhesive coating
>Available in varies thicknesses
>Broad range of hardnesses available

Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF120N-40-10F Series
Color
Gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.1 g/cm3

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
0.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

55±5 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity
4.0W/mk
ISO22007-2.2
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.7 MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
4.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

4.0 W/Mk Mainboard Thermal Gap Pad 0.5mm Thickness

FAQ:

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.


Product Tags:

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Quality 4.0 W/Mk Mainboard Thermal Gap Pad 0.5mm Thickness for sale

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