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75 Shore 00 Thermal Gap Pad Easy Release Construction For MD LED Module

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75 Shore 00 Thermal Gap Pad Easy Release Construction For MD LED Module

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Brand Name : ZIITEK

Model Number : TIF1160-20-10UF thermal pad

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Color : gray

Thickness : 4.0mmT

Volume Resistivity : 1.0X10^12 Ohm-cm

name : 75 Shore 00 Easy Release Construction Heat Sink Pad for MD LED Module

keyword : thermal gap pad

Dielectric Constant : 4.6 MHz

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75 Shore 00 Easy Release Construction Heat Sink Pad for MD LED Module

The TIF1160-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-20-10UF-Datasheet-REV02.pdf

Features

> Good thermal conductive: 2.0 W/mK

>Thickness: 4.0mmT

>hardness:75 shore 00

>Colour: Gray

>Outstanding thermal performance
>High tack surface reduces contact resistance
>RoHS compliant

Applications

>Waterproof LED Power

>SMD LED module

>LED Flesible strip, LED bar

>LED PanelLight

>LED floor light

>Routers

Typical Properties of TIF1160-20-10UF Series
Color
gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.7 g/cc

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
4.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

75 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.6 MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
2.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

75 Shore 00 Thermal Gap Pad Easy Release Construction For MD LED Module

FAQ:

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


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