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Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

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Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

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Brand Name : ZIITEK

Model Number : TIF1200-30-06UF

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Thickness : 5.0mmT

name : Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules

Fire rating : 94 V0

keyword : thermal gap pad

Feature : Moldability for complex parts

color : White

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Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules

The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF1200-30-06UF is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

TIF100-30-06UF-Series-Datasheet-.pdf

Features

> Good thermal conductive: 3.0 W/mK

>Thickness: 5.0mmT

>hardness:75±5 shore 00

>Colour: White

>Moldability for complex parts
>Outstanding thermal performance
>High tack surface reduces contact resistance

Applications

>cooling components to the chassis of frame

>High speed mass storage drives

>Heat Sinking Housing at LED-lit BLU in LCD

>LED TV and LED-lit lamps

>RDRAM memory modules

>Micro heat pipe thermal solutions

Typical Properties of TIF1200-30-06UF Series
Color
White
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.0 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
5.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

75±5 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.32%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

5.0 MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
2.3X1013
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

FAQ:

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.


Product Tags:

3.0 g/cc thermal gap pad

      

memory modules thermal gap pad

      

3.0 g/cc thermal interface pad

      
Quality Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules for sale

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