Home > Thermal Gap Pad >

3.5mmt Notebook Heat Insulation Silicone Pad Outgassing 0.35%

Product Categories

Phase Changing Materials [38]
Thermal Conductive Pad [155]
Thermal Gap Filler [189]
Thermal Conductive Grease [27]
Thermal Insulation Materials [46]
Thermal Graphite Sheet [53]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

3.5mmt Notebook Heat Insulation Silicone Pad Outgassing 0.35%

Name: 35mmt Notebook Heat Insulation Silicone Pad Outgassing 035
Brand: ZIITEK
Price: 1 USD

Quality 3.5mmt Notebook Heat Insulation Silicone Pad Outgassing 0.35% for sale

Brand Name : ZIITEK

Model Number : TIF1140-30-02US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Fire rating : 94 V0

Thickness : 3.5mmT

Thermal conductivity : 3.0 W/m-K

keyword : Thermal Gap Pad

name : 3.5mm Moldability for Complex Parts Silicone Pads for Notebook, Outgasing 0.35%

Hardness : 20 Shore 00

Contact Now

3.5mm Moldability for Complex Parts Silicone Pads for Notebook, Outgasing 0.35%

The TIF1140-30-02US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-30-02US-Datasheet-REV02.pdf

Features

> Good thermal conductive: 3.0 W/mK

>Thickness:3.5mmT

>hardness:20 shore 00

>Colour: Gray

>Good thermal conductive

>Electrically isolating

>High durability

Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF1140-30-02US Series
Color	Gray	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	2.9 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	3.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	20 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.35%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	3.8 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	3.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

3.5mmt Notebook Heat Insulation Silicone Pad Outgassing 0.35%

FAQ:

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Product Tags:

3.5mmt Notebook Heat Insulation Silicone Pad Outgassing 0.35% Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

3.5mmt Notebook Heat Insulation Silicone Pad Outgassing 0.35%

3.5mmt Notebook Heat Insulation Silicone Pad Outgassing 0.35%

3.5mmt thermally conductive gap filler pads

3.5mmt heat insulation silicone pad

notebook heat insulation silicone pad

3.5mmt Notebook Heat Insulation Silicone Pad Outgassing 0.35% Images