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Specific Gravity 3.0 G/Cc Silicone Thermal Pads Conductive For Notebook

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Specific Gravity 3.0 G/Cc Silicone Thermal Pads Conductive For Notebook

Name: Specific Gravity 30 GCc Silicone Thermal Pads Conductive For Notebook
Brand: ZIITEK
Price: 1 USD

Quality Specific Gravity 3.0 G/Cc Silicone Thermal Pads Conductive For Notebook for sale

Brand Name : ZIITEK

Model Number : TIF130-30-06UF

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Application : Heat pipe thermal solutions

Outgassing(TML) : 0.32%

Volume Resistivity : 2.3X1013 Ohm-cm

keyword : Thermal Gap Pad

Specific gravity : 3.0 g/cc

name : Specific gravity 3.0 g/cc Good thermal conductive silicone pads for notebook

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Specific gravity 3.0 g/cc Good thermal conductive silicone pads for notebook

The TIF130-30-06UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

TIF100-30-06UF-Series-Datasheet-.pdf

Features

> Good thermal conductive: 3.0 W/mK

>Thickness: 0.75mmT

>hardness:75±5 shore 00

>Colour: White

>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating

Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF130-30-06UF Series
Color	White	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.0 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	0.75mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	75±5 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.32%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	5.0 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	2.3X10¹³ Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	3.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Specific Gravity 3.0 G/Cc Silicone Thermal Pads Conductive For Notebook

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Specific Gravity 3.0 G/Cc Silicone Thermal Pads Conductive For Notebook

Specific Gravity 3.0 G/Cc Silicone Thermal Pads Conductive For Notebook

3.0 g/cc thermally conductive gap filler pads

3.0 g/cc silicone thermal pads

silicone thermal pads for notebook

Specific Gravity 3.0 G/Cc Silicone Thermal Pads Conductive For Notebook Images