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Thermal Gap Filler 1.2w/MK Densentity 2.0 G/Cm3 For RDRAM Memory Modules

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Thermal Gap Filler 1.2w/MK Densentity 2.0 G/Cm3 For RDRAM Memory Modules

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Brand Name : ZIITEK

Model Number : TIF120-12-05ES

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Hardness : 12±5 Shore 00

density : 2.0 g/cm3

Dielectric Breakdown Voltage : >5500 VAC

Fire rating : 94-V0

Construction & Compostion : Ceramic filled silicone rubber

Tensile Strength : 40 psi

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China company supplied thermal gap filler 1.2w/MK densentity 2.0 g/cm3 for RDRAM memory modules

The TIF120-12-05ES is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling


TIF100-12-05ES-Series-Datasheet.pdf

Features:
> Good thermal conductive: 1.2 W/mK
>Thickness:0.5mmT
>hardnesses :12±5 (Shore 00)

>UL recognized

>Fiberglass reinforced for puncture, shear and tear resistance

>Easy release construction

>Electrically isolating

>High durability

Applications:

>RDRAM memory modules

>Micro heat pipe thermal solutions

>Automotive engine control units

>CD-Rom, DVD-Rom cooling

>LED Power Supply

>LED Controller

>LED Ceilinglamp

Typical Properties of TIF120-12-05ES Series
Color

blue

 Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
 *** 10mils / 0.254 mm

0.55
20mils / 0.508 mm

0.82
desity

2.0 g/cm3

 ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11
Thickness

0.5mmT

 ***

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45
Hardness
 12±5 (Shore 00) ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77

Tensile Strength

40 psi

 ASTM D412

90mils / 2.286 mm

1.91

100mils / 2.540 mm

2.05
Continuos Use Temp
 -40 to 160℃

***

110mils / 2.794 mm

2.16

120mils / 3.048 mm

2.29

Dielectric Breakdown Voltage
 >5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56
Dielectric Constant
 4.5MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77
Volume Resistivity
 1.0X1012
Ohm-meter		 ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98
Fire rating
 94 V0

equivalent UL

190mils / 4.826 mm

3.05

200mils / 5.080 mm

3.14
Thermal conductivity
1.2 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Thermal Gap Filler 1.2w/MK Densentity 2.0 G/Cm3 For RDRAM Memory Modules

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

FACTORY INFORMATION:

Factory Size

5,000-10,000 square meters

Factory Country/Region

Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Annual Output Value

US$1 Million - US$2.5 Million


Product Tags:

1.2w/MK Thermal Gap Filler

      

2.0 G/Cm3 Thermal Gap Filler

      

Thermal Filler For RDRAM Memory Modules 

      
Quality Thermal Gap Filler 1.2w/MK Densentity 2.0 G/Cm3 For RDRAM Memory Modules for sale

Thermal Gap Filler 1.2w/MK Densentity 2.0 G/Cm3 For RDRAM Memory Modules Images

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