Naturally tacky grey Good Thermal Conductive pad For CPU Heat Dissipation 3.0 W/mK RoHS compliant TIF500-30-11US 25 Sh

Naturally tacky blue Good Thermal Conductive pad For CPU Heat Dissipation 3.0 W/mK RoHS compliant TIF500-30-11US 25 Shore 00


The TIF500-30-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features:
> Good thermal conductive: 3.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.

Company Profile

1. Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

FAQ:

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

TIF500-30-11US Datasheet-REV02.pdf

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Naturally tacky grey Good Thermal Conductive pad For CPU Heat Dissipation 3.0 W/mK RoHS compliant TIF500-30-11US 25 Sh Images