Sign In | Join Free | My infospaceinc.com
China Dongguan Ziitek Electronic Materials & Technology Ltd. logo
Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronical Material and Technology, Ltd. -- Professional TIM Manufacturer
Verified Supplier

11 Years

Home > Thermal Conductive Pad >

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

Dongguan Ziitek Electronic Materials & Technology Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

  • 1
  • 2

Brand Name : ZIITEK

Model Number : TIF100-40-11US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : Negotiation

Payment Terms : T/T

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Prodcuts name : Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

Application : Electronic Components 5G Aerospace AI

Thickness : 0.010"(0.25mm)~0.200"(5.0mm)

Thermal conductivity : 4.0W/m-K

Keywords : Thermal Gap Pad

Hardness : 65/20 Shore 00

Density : 3.2g/cm³

Color : Dark Grey

Recommended Operating Temperature : -40 to 200℃

Contact Now

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit.It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features


> Good thermal conductive: 4.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses


Applications


> Cpu heat sinking
> High speed mass storage drives
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Home appliance industry
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

Typical Properties of TIF®100-40-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0W/m-K ASTM D5470
4.0W/m-K ISO22007

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm)
with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

Company profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.


Product Tags:

silicone thermal gap pad

      

thermal conductive pad for electronics

      

5G aerospace thermal pad

      
Quality Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI for sale

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)